This document provides information for designing project specific Carrier Boards for systems using COMHPC Modules. This document is a design guide and not a specification document. It should be used by together with the COM-HPC Base Specification, with other industry specifications (listed in Section 1.9. below), with silicon and component vendor’s documentation and with your COM-HPC Module vendor’s product documentation.
Intended Audience
This design guide is intended for electronics engineers and PCB layout engineers designing Carrier Boards for PICMG COM-HPC Modules. It may also be useful to COM-HPC Module designers for them to better understand how COM-HPC Modules are used, and to understand how some of the design rules (trace length recommendations, trace length matching recommendations etc.) are shared between Module and Carrier designs.
Revision 2.2 of this document includes numerous notes that clarify how COM-HPC Client examples need to be modified slightly for use in COM-HPC Mini designs. The differences between the COM-HPC Client and the Mini are well described in the COM-HPC Module Base Specification Rev. 1.20, primarily in Section 10 of that document. The notes that clarify the COM-HPC Mini differences are presented in this bold italic blue font to make the notes stand out.
Additional Notes
The PICMG COM Express Carrier Board Design Guide is also a very useful additional source of information. The COM-HPC and COM Express pin names are not the same, but it is not hard to correlate them. The COM Express design guide document is available for free download on the public PICMG website (www.picmg.org). No membership is required to down load the design guides.
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