Summary of the core aims of this specification
1. Allow for device revision identification.
2. Allow standardized cross vendor cross platform I2C EEPROM data storage and retrieval.
Specifically product/marketing/branding information.
3. Allow for more flexible generic approach to data storage, sharing.
4. Facilitate vendor specific data storage in a multi vendor environment.
5. Facilitate the consolidation of data currently stored in multiple discrete devices, into one device. E.g. PICMG EEPROM, OEM specific EEPROM, display device EEPROM.
6. Reduce the TCO for the PICMG EEPROM, for carrier and module vendors and OEMs.
- 1. Allow EEPROM consolidation.
- 2. Allow for maximum code reuse.
7. Reduce manufacturing cost, through allowing standardized approach to system provisioning.
8. Improve EEPROM access characteristics and increase EEPROM device selection flexibility.
This document contains COM Express as well as COM-HPC specific content. The COM Express parts have been kept for backwards compatibility, while the specification has been extended for COM-HPC. A new revision has been assigned to distinguish between COM Express and COM-HPC EEPROMs. Apart from this document (EeeP for COM-HPC), there is also the COM-HPC Platform Management Interface Specification, as well as the COM-HPC Module Base Specification. These documents refer to each other and deal with the data structures (EeeP, this document), general management architecture (Management Interface Specification), and the hardware architecture (Module Base Specification), respectively.
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