COM-HPC®(for “Computer on Module – High Performance Computing”) is a PICMG® sponsored open standard for a family of high performance computer modules targeting the embedded computer space. The embedded space differs from the commercial space with respect to features such as long term availability, extended temperature operation, mechanical ruggedness, hardware and firmware that can be customized to the application, and Module vendor support to product developers.
In the COM development model, the COMs are standard product offerings, and they are used with Carrier boards that are usually application specific, with additional features, connectors and geometries suited to the customer product at hand.
COM-HPC® is related to COM Express®(COMe for short), but there are significant differences. COM-HPC® is meant to complement COMe, not replace it. COMe will live on for many years. Some features on COM-HPC® that are generally not available on COMe include:
- Significantly larger form factors on COM-HPC®
- An improved Module – Carrier connector ◦ COM-HPC® connector has 3x the bandwidth of COMe (32 Gtps vs 10 Gtps)
- 800 connector pins on COM-HPC® vs. 440 max on COMe
- Supports up to 8 full size DIMMs (vs. no full-size DIMMs on most COMe boards)
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